German semiconductor major Infineon Technologies has announced the sale of its NOR FLASH and F-RAM business to Taiwan's Winbond in a $1.12 billion all-cash transaction. According to ElectronicsWorld, the business serves customers across automotive, industrial and infrastructure markets. The deal represents a strategic move to further focus Infineon's portfolio and capital allocation on its core growth drivers, as stated by Peter Schiefer, president of Infineon's Automotive Division. The transaction is expected to be concluded in the second half of 2027, subject to obtaining required regulatory approvals.
The Munich-headquartered company currently works with more than 1,200 customers across India, ranging from startups to some of India's largest and most successful companies. As reported by Business Standard, Infineon has expanded its domestic workforce by 28 per cent over the past year, bringing its headcount to over 2,800 employees across Ahmedabad, Bengaluru, and Hyderabad. The company has been operating in India for more than 25 years and continues to strengthen its presence across multiple Indian cities.
According to Business Standard, Infineon has expanded its Global Capability Centre (GCC) in Ahmedabad, strengthened its research and development (R&D) presence in Hyderabad, and is setting up a new state-of-the-art campus in Bengaluru. The company emphasized that success in the sector cannot be achieved in isolation, with sustainable chip ecosystems relying on strong partnerships between industry, government, and academia.
The NIELIT-Infineon Centre of Excellence on Semiconductor Manufacturing was inaugurated virtually by Union Minister of State Jitin Prasada on September 16, 2025, at NIELIT, Ahmedabad, Gujarat. As reported by The Tribune, the Centre of Excellence marks an important milestone in a partnership that began when NIELIT and Infineon Technologies signed their first understanding on March 17, 2025. The facility provides eight units of industry-grade semiconductor manufacturing equipment, including 2 ASM AD838 Die/Glue Bonders, 2 SHINKAWA UTC1000 Wire Bonders, 2 BESI FICO Moulding Machines, and 2 BESI FICO Trim-and-Form Machines. The equipment will enable learners to understand sequential operations in die bonding, wire bonding, moulding, trimming and lead forming, providing exposure to actual semiconductor backend manufacturing workflows.
To support talent development, Infineon has announced a strategic partnership with the National Institute of Electronics and Information Technology (NIELIT) to establish a Centre of Excellence. As reported by The Tribune, the Centre will cater to diploma holders, engineering students, technicians, working professionals and faculty, providing exposure to semiconductor technologies and hands-on experience with industry-relevant equipment. The facility will support short-term and long-term training programmes, laboratory modules, faculty development programmes, training-of-trainers initiatives and industry-oriented curricula in semiconductor packaging and backend manufacturing. Dr. Madan Mohan Tripathi, Director General of NIELIT, highlighted that the Centre reflects the shared commitment towards developing skilled human capital for India's rapidly expanding semiconductor industry.
