Xiaomi Corp. has achieved a historic milestone with its Xring O3 mobile processor, becoming the first mobile SoC to cross the 5-million mark on AnTuTu benchmark. According to latest reports, the Beijing-based company announced the development through a post on Chinese social media platform Weibo on Monday, with the chipset scoring 5.22 million points on the benchmark. The Xring O3 system-on-a-chip advances Xiaomi's in-house semiconductor design efforts with more power-efficient image processing and better artificial intelligence capabilities.
The new silicon is manufactured using a 3-nanometer fabrication process, as confirmed by founder Lei Jun in a WeChat post. According to Reuters, Xiaomi has contracted Taiwan Semiconductor Manufacturing Co. to manufacture the chips, with TSMC manufacturing the new chip using its 3-nanometre production technology. The 3-nanometer node places Xiaomi's new chip closer to the manufacturing process used for Apple Inc.'s most recent A19 Pro chips and well ahead of its biggest home rival Huawei Technologies Co.'s in-house designs. The Xring O3 features a 10-core CPU that delivers up to 60% improvement in performance, while the 16-core G2-Ultra NX GPU provides up to 85% higher graphics performance with 64% improved power efficiency.
The chipset offers up to 200 TOPS of tensor performance and 3.13 TFLOPS of vector performance, with NPU performance increased by 45%. Xiaomi claims AI acceleration is spread across different parts of the chip, including the CPU, GPU, ISP, DPU and ADSP. The Xring O3 also brings LPDDR6 memory support, making it Xiaomi's first mobile chipset to support the newer memory standard with memory bandwidth of up to 113.8GB/s. The Xring O100 is a 6nm AI accelerator that stacks chip and memory vertically to reach 1.22TB/s of near-memory bandwidth, specifically designed for on-device AI applications in phones, cars and robots.
As reported by Reuters, San Diego, California-based Qualcomm and Taiwan's MediaTek have long provided Xiaomi's key processors. The Chinese company, which also designs and produces electric vehicles, is building on years of its own research on semiconductors to lower reliance on foreign chips. Xiaomi has confirmed that the Xring O3 will make its debut on the Xiaomi 18 Fold and Pad 9 Pro Max launching in September, with preorders for the foldable already open. Having an in-house chip for its flagship products would strengthen Xiaomi's bargaining position with suppliers and boost its consumer appeal in a fiercely competitive market. The Xring D100 is built for intelligent driving, with a 20-core CPU, support for 160GB of unified memory, and the ability to run 200-billion-parameter models locally, with commercial availability set for 2027.
Beyond the Xring O3, Xiaomi has introduced two additional chipsets as part of its broader push into in-house silicon. The Xring O100 is designed with AI workloads in mind, specifically supporting Xiaomi's MiMo large language model on consumer devices, while the Xiaomi showed all three running together inside the AI Cube, a prototype mini-PC that handles models up to 120B parameters. The Xring D100 is aimed at intelligent-driving applications, with the company demonstrating the complete ecosystem's capabilities. This comprehensive approach allows Xiaomi to develop chips that can serve different parts of its growing hardware ecosystem, giving the company greater control over how its hardware and software work together while reducing dependence on third-party chipmakers.
